发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition high in rigidity and excellent in molded article flatness, surface appearance and electrical characteristics, and a molded article thereof. SOLUTION: The polyamide resin composition contains (A) 100 pts. wt. of a polyamide resin, (B) 5-50 pts. wt. of a glass fiber, (C) 5-50 pts. wt. of talc which has a residue of ≤0.1 wt% on a 350 mesh sieve when measured according to JIS K5101 and has a pH of 8-10, (D) 0.05-3 pts. wt. of carbon black, (E) 0.01-2 pts. wt. of an azine dye and (F) 0.01-1 pt. wt. of a metal salt of a higher fatty acid. Its molded article is also provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162821(A) 申请公布日期 2005.06.23
申请号 JP20030401687 申请日期 2003.12.01
申请人 ASAHI KASEI CHEMICALS CORP 发明人 MORI SHIGEO;NABESHIMA KATSUMI
分类号 C08L77/00;C08K3/04;C08K3/34;C08K5/00;C08K5/098;C08K7/14;(IPC1-7):C08L77/00 主分类号 C08L77/00
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