| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip capable of obtaining the semiconductor chip at a high production efficiency without being damaged. SOLUTION: The method for manufacturing the semiconductor chip comprises the tape adhering step of adhering a dicing adhesive tape having an adhesive layer containing a gas generator which generates a gas by irradiating a light on a semiconductor wafer formed with a circuit, the dicing step of dicing a wafer to which the dicing adhesive tape is adhered, to divide it into individual semiconductor chips, the exfoliation step of irradiating a light on the entire face of the divided individual semiconductor chips to exfoliate at least a part of the dicing adhesive tape from the semiconductor chip, and the pickup step of picking up the semiconductor chips by a needle pickup method. COPYRIGHT: (C)2005,JPO&NCIPI |
