| 摘要 |
PROBLEM TO BE SOLVED: To provide connection structure of an electronic component wherein a void generation portion is made not to exist under a back fillet, so that generation of cracks is restrained. SOLUTION: The void generation portion (via 20) to be formed on a pad (26) is arranged on a position in the region of the pad (26) which position is isolated at least predetermined distance (α) from the arrangement position of the crookedness portion (24b) of a lead (24) to the tip (24a1) direction of a pad contact portion (24a. a portion mounted on the pad 26). Concretely, the predetermined distance (α) is set to a value longer than the pad contact (24a), and the void generation portion (via 20) is arranged below a front fillet (30f). COPYRIGHT: (C)2005,JPO&NCIPI
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