发明名称 VACUUM COOLING METHOD, AND ITS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a vacuum cooling method, and its device preventing scattering, and boiling over of an object to be cooled due to bumping in a cooling tank, and capable of improving cooling capacity. SOLUTION: The device is provided with the cooling tank 3, a first vessel 5 arranged in the cooling tank 3 and holding the object 4 to be cooled, a second vessel 7 storing a liquid 6 and arranged such that an outer circumferential face of the first vessel 5 and the liquid 6 are in a contact state, and a pressure reduction means 8 for reducing a pressure in the cooling tank 3. Or it is provided with the cooling tank 3, the first vessel 5 arranged in the cooling tank 3 and holding the object 4 to be cooled, an impregnation member provided in a contact state with the outer circumferential face of the first vessel 5 and impregnated with the liquid 6, and the pressure reduction means 8 for reducing the pressure in the cooling tank 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005134027(A) 申请公布日期 2005.05.26
申请号 JP20030370225 申请日期 2003.10.30
申请人 MIURA CO LTD 发明人 SENOO YASUTOSHI;TANAKA OSAMU;YANAGIHARA NOBUAKI;YAMAMOTO DAISUKE
分类号 F25D7/00;A23L3/36;(IPC1-7):F25D7/00 主分类号 F25D7/00
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