发明名称 ADHESIVE SHEET FOR DICING, DICING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing to prevent the deterioration of product fidelity or the disadvantage of cost performance, to suppress the generation of thread-like dusts at the time of dicing, to prevent a film from being torn in an expand process, and to reduce the generation of chipping. SOLUTION: In an adhesive sheet (1) for dicing constituted by forming an adhesive layer (12) on at least one face of a base material film (11), the base material film (11) is a multi-layer film with two or more layers, and at least the two layers of the multi-layer film contain olefin system thermoplastic elastomer containing propylene as polymeric components whose melting peak temperatures range from 120°C to 170°C, and the olefin system thermoplastic elastomer contained in at least the two layers is provided with different propylene content. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005129763(A) 申请公布日期 2005.05.19
申请号 JP20030364407 申请日期 2003.10.24
申请人 NITTO DENKO CORP;MITSUBISHI CHEMICALS CORP 发明人 YAMAMOTO MASASHI;TAKAYANAGI KENJIRO
分类号 B32B25/14;B32B27/00;B32B27/32;C09J7/02;C09J133/00;H01L21/30;H01L21/301;H01L21/304;H01L21/78;(IPC1-7):H01L21/301 主分类号 B32B25/14
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