| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition; to provide an adhesive film obtained by using the composition, having low modulus, excellent adhesiveness and excellent heat resistance, and suitably usable for production of various kinds of electronic parts; and to provide an adhesive tape for dicing/die bond, providing a wafer-fixing power resisting to the dicing by thermocompression bonding, and having stability of adhesion (cohesion) between an adhesive layer and a die bond layer, and excellent adhesiveness to a lead frame. <P>SOLUTION: The adhesive composition contains (A) a polyimide resin having a phenolic hydroxy group and a siloxane bond in a polymer skeleton, (B) an epoxy compound represented by formulas (1) or (2) (wherein, R<SP>1</SP>is a hydrogen atom or a monovalent organic group), and (C) an epoxy resin-curing catalyst as essential components. The adhesive film is obtained by using the composition. The adhesive tape for the dicing/die bond is obtained by laminating the adhesive film on a silicone adhesive layer formed on a base material. The cohesion between the silicone adhesive layer and the adhesive film is regulated so as to be 0.2-2.0 N/25 mm. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
