| 摘要 |
<p>An electric connection selectively linking elements (10, 12) on an integrated circuit substrate (28) comprises: (a) realizing the elements on a substrate of which a part of the surface is made of a first material, depositing, on the substrate and the elements, a second conducting material (44, 46) that is able to create a reaction with the first material to form a conducting material on the substrate surface; (b) treating the substrate to produce the reaction; and (c) realizing a selective withdrawal of the second material that has not reacted with the first material, in order to leave some of the second material according to a pattern that corresponds with at least a part of the connection. An independent claim is also included for an integrated circuit incorporating the above electrical connections.</p> |
