PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN USING THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a pattern for obtaining a hardened film which can be hardened at a low temperature and has excellent photosensitive characteristics and high sensitivity, which results in a pattern with a favorable profile even with low exposure, which shows a high residual film rate after development, little shrinkage of a coating film after heating and hardening and which has excellent hardened film characteristics, and for decreasing the manufacturing processes and the manufacturing cost.

SOLUTION: The photosensitive resin composition contains: (A) a polyimide precursor having a repeating unit expressed by general formula (I); (B) an addition polymerizable compound having ≤350 molecular weight; and (C) a photoinitiator. In general formula (I), X represents a group containing a tetravalent aromatic ring; Y represents a group containing a divalent aromatic ring; each of R1 and R2 independently represents a hydrogen atom or a monovalent organic group; and at least either X or Y in a plurality of repeating units has two or more kinds of structures with different numbers of aromatic rings.

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