发明名称 Material for diamond sintered body die and diamond sintered body die
摘要 To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing. A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tungsten alloy, and the inner diameter thereof is tapered. The diamond compact is tapered so as to fit to the taper of the cylinder and the diamond compact is press-fitted to the holding ring. For lower cost production, the tapered face of the diamond compact is formed by electric spark machining. The tungsten alloy contains 90% to 97% by weight of tungsten and 3% to 10% by weight of nickel.
申请公布号 US2005076897(A1) 申请公布日期 2005.04.14
申请号 US20040497084 申请日期 2004.05.28
申请人 YOSHIDA MINORU;NAKASHIMA TAKERU;YAMAGUCHI TADASHI 发明人 YOSHIDA MINORU;NAKASHIMA TAKERU;YAMAGUCHI TADASHI
分类号 B21C3/02;B21C3/18;(IPC1-7):B28D5/02;B23H1/00 主分类号 B21C3/02
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