发明名称 |
Material for diamond sintered body die and diamond sintered body die |
摘要 |
To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing. A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tungsten alloy, and the inner diameter thereof is tapered. The diamond compact is tapered so as to fit to the taper of the cylinder and the diamond compact is press-fitted to the holding ring. For lower cost production, the tapered face of the diamond compact is formed by electric spark machining. The tungsten alloy contains 90% to 97% by weight of tungsten and 3% to 10% by weight of nickel.
|
申请公布号 |
US2005076897(A1) |
申请公布日期 |
2005.04.14 |
申请号 |
US20040497084 |
申请日期 |
2004.05.28 |
申请人 |
YOSHIDA MINORU;NAKASHIMA TAKERU;YAMAGUCHI TADASHI |
发明人 |
YOSHIDA MINORU;NAKASHIMA TAKERU;YAMAGUCHI TADASHI |
分类号 |
B21C3/02;B21C3/18;(IPC1-7):B28D5/02;B23H1/00 |
主分类号 |
B21C3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|