发明名称 SILICON DIOXIDE REMOVING METHOD
摘要 A method for removing silicon dioxide residuals is disclosed. The method includes reacting a portion of a silicon dioxide layer (i.e., oxide) to form a reaction product layer, removing the reaction product layer and annealing in an environment to remove oxide residuals. The method finds application in a variety of semiconductor fabrication processes including, for example, fabrication of a vertical HBT or silicon-to-silicon interface without an oxide interface.
申请公布号 US2005070101(A1) 申请公布日期 2005.03.31
申请号 US20030605435 申请日期 2003.09.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GEISS PETER J.;JOSEPH ALVIN J.;LIU XUEFENG;NAKOS JAMES S.;QUINLIVAN JAMES J.
分类号 H01L21/302;H01L21/311;H01L21/331;H01L21/461;(IPC1-7):H01L21/302 主分类号 H01L21/302
代理机构 代理人
主权项
地址