| 摘要 |
A structure of a print pattern connecting two modular jacks in series is provided to improve transfer characteristics of a high-speed broadband communication signal by optimalizing transfer characteristics of a distributed constant circuit. A print board is connected between two modular jacks(11,14) that face with each other. A print pattern is formed on an upper surface and a lower surface of the print board. Each of the modular jacks has 8 pins and 4 pins located closely to each other are arranged such that a gap among 4 pins is formed in a rage of 22 mm to 30 mm. The print board has thickness in a range of 1.4 mm to 1.8 mm. A print pattern having valid width in a range of 68 square millimeters to 95 square millimeters is formed at the outside of a print pattern that connects 3th pin and 4th pin on the upper surface of the print board. |
