| 摘要 |
Heat removal while a semiconductor laser emits a laser beam, and heat insulation with respect to optical devices are sought to be improved. A semiconductor integrated apparatus is so configured to include a base member formed of a metal material or a ceramic material, a housing formed of a resin material or a glass material, and a device arrangement block. A substrate on which are mounted predetermined optical devices including a semiconductor laser is placed on the base member. The housing covers the substrate placed on the base member. The device arrangement block is attached to the housing and has optical devices that are different from those described above.
|
