| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a nitride semiconductor laser device that can easily control the outgoing position of a laser and is superior in yield. SOLUTION: Solder is adhered in advance to the supporting substrate (102) of a stem (601), a nitride semiconductor laser chip (401) is mounted thereto, and then the solder is melted to fix the nitride semiconductor laser chip (401) on the supporting substrate (102). The thickness of the solder adhered to the supporting substrate (102) is ≥0.2 μm and ≤20 μm, and the thickness thereof after the nitride semiconductor laser chip (401) is fixed is ≥0.1 μm and ≤5 μm. COPYRIGHT: (C)2005,JPO&NCIPI
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