METHOD AND APPARATUS FOR IMPROVING ADHESION PROPERTY BETWEEN METAL MASK AND SUBSTRATE BY ADHESION FORCE SUCH AS MAGNETIC FORCE AND ELASTIC FORCE, AND SPUTTERING METHOD AND SPUTTERING APPARATUS USING THE SAME

摘要

PURPOSE: To provide a method and an apparatus for more closely contacting a substrate with a mask, and a sputtering method and a sputtering apparatus for more closely contacting the substrate with the mask when performing sputtering. CONSTITUTION: The apparatus for closely contacting a substrate with a mask comprises a stage which provides a first adhesion force, and on which the substrate is put; and a frame for positioning a pattern formed mask on the substrate, wherein the first adhesion force is provided to the substrate and the mask when closely contacting the substrate with the mask, wherein the stage is formed of a member having magnetic force for providing the first adhesion force, and the mask is formed of a metallic material, wherein the apparatus further comprises a member installed on the frame to provide a second adhesion force to the substrate and the mask when closely contacting the substrate with the mask, and wherein the second adhesion force providing member is a member having elastic force. The sputtering apparatus comprises a stage(130) which provides a first adhesion force, and on which the substrate(120) is put; a frame(111) for positioning a pattern formed mask(110) on the substrate; and a sputtering target(100) having a material to be deposited on the substrate, wherein the first adhesion force is provided to the substrate and the mask when closely contacting the substrate with the mask to form patterns by sputtering.