发明名称 |
SEMICONDUCTOR MEMORY DEVICE AND FABRICATING METHOD THEREOF FOR REDUCING RESISTANCE OF EACH OF BIT LINES |
摘要 |
PURPOSE: A semiconductor memory device and a fabricating method thereof are provided to reduce a resistance of each of bit lines by forming each of the bit lines with a diffusion bit line and a metal bit line. CONSTITUTION: A plurality of linear word lines(11) are formed on a semiconductor substrate(10). A plurality of linear bit lines meet at right angles to the word lines. A memory transistor is formed between the bit lines in the semiconductor substrate and employs the word lines as a gate electrode. An interlayer dielectric is formed on the memory transistor. Each of the bit lines is formed with a diffusion bit line(211) formed in the semiconductor substrate and a metal bit line(212) formed with being buried in the interlayer dielectric in a linear pattern and connected with the diffusion bit line between the word lines.
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申请公布号 |
KR20050015984(A) |
申请公布日期 |
2005.02.21 |
申请号 |
KR20040045063 |
申请日期 |
2004.06.17 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
SHIMIZU, SATOSHI |
分类号 |
H01L21/8247;H01L21/8239;H01L21/8246;H01L27/10;H01L27/115;H01L29/76;H01L29/788;H01L29/792;(IPC1-7):H01L27/10 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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