发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor element whose characteristics can be improved by forming a cobalt silicide film without losing the dopant. SOLUTION: Included are the stages of: forming a junction area 15 in a specified area on a semiconductor element after forming the gate in the specified area on the semiconductor substrate 11 and forming a spacer 14 on its side wall; forming a cobalt layer 18 and a buffer layer on the whole structure; forming a cobalt monosilicide film 20 on the gate and a junction area by carrying out a primary RTP process; forming an amorphous cobalt silicide film by making the surface of the cobalt monosilicide film amorphous by carrying output a carbon injecting process; and forming a cobalt disilicide film 21 by carrying output a secondary RTP process after removing a non-reacting cobalt film and the buffer layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005039184(A) 申请公布日期 2005.02.10
申请号 JP20030413096 申请日期 2003.12.11
申请人 HYNIX SEMICONDUCTOR INC 发明人 KIM UI SIK
分类号 H01L21/28;H01L21/24;H01L21/265;H01L21/285;H01L21/336;H01L21/4763;H01L21/8234;H01L27/088;H01L29/417;H01L29/78;(IPC1-7):H01L21/336;H01L21/823 主分类号 H01L21/28
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