发明名称 |
MOUNTING METHOD AND APPARATUS FOR ELECTRICAL COMPONENTS |
摘要 |
A heat sink (12) is formed from a base component (14) and a clamping compone nt (16). The base component (14) and clamping component (16) include a locking groove (18) and a tab (20) for insertion into the locking groove (18). The clamping component (16) includes at least one clamping leg (22). The base component (14) includes a surface (24). The clamping leg (22) is designed to snap over the surface (24) to couple the two components (14, 16) together an d capture between them in heat conducting relationship with at least one of th e components (14, 16) at least one device (10-1, ... 10-n) which evolves heat during its operation. |
申请公布号 |
CA2377336(C) |
申请公布日期 |
2005.02.08 |
申请号 |
CA20002377336 |
申请日期 |
2000.09.26 |
申请人 |
HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED |
发明人 |
GUTHRIE, BRIAN S. |
分类号 |
H01L23/36;H01L23/40;H05K7/20;(IPC1-7):H01L23/40 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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