| 摘要 |
<p>A method and apparatus for forming wafers (50) of varying thicknesses. The apparatus includes a template. The template is formed of a main disk (36) including a plurality of cavities (26) extending into a first side thereof and a backing plate (34) positioned on one side of the main disk opposite the first side. Holding disks are moistened and positioned within the cavities (26) for releasably securing a wafer in the cavity (26). When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities (26) are lapped and polished upon rotation of the rotating head.</p> |
