| 摘要 |
<P>PROBLEM TO BE SOLVED: To significantly increase the quantity of light made incident on an optical fiber by firstly enabling the light emitting surface of an LED (light emitting diode) chip to get a large area by providing a bonding pad at a position other than the light emitting surface of the chip and secondly improving the luminous efficiency of the chip by eliminating light emission from the back of the bonding pad by forming the pad at a position from which an active layer is etched off. <P>SOLUTION: A mesa-like light emitting section is formed on the surface of the P-type clad layer of the LED chip formed in a rectangular shape by etching the clad layer to nearly a semiconductor substrate section except a nearly square portion which becomes the light emitting section and an insulating layer is formed from the etched surface of the semiconductor substrate section to the surface of the P-type clad layer through the mesa end face of the light emitting section. The LED for optical fiber is characterised in that the bonding pad is formed on the insulating layer at a position lying above the semiconductor substrate section and, at the same time, electrically connected to an ohmic electrode laid on the surface of the P-type clad layer by means of a crossover section formed through the surface of the insulating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
