发明名称 Global chip interconnect
摘要 A global interconnect distribution system is disclosed. The global interconnect distribution system includes a global interconnect cell capable of producing at least two substantially identical output signals, and a global interconnect coupled to the cell for carrying one of the output signals. At least one wire is also coupled to the cell that is routed adjacent to the global interconnect for carrying the other output signal to provide active shielding for the global interconnect, thereby increasing signal integrity and signal transmission of the global interconnect.
申请公布号 US6842042(B2) 申请公布日期 2005.01.11
申请号 US20020242165 申请日期 2002.09.11
申请人 LSI LOGIC CORPORATION 发明人 TETELBAUM ALEXANDER
分类号 H01L23/522;H04L25/08;H04L25/24;(IPC1-7):H01L25/00;H03K19/003 主分类号 H01L23/522
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