| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a vertical boat for heat-treating semiconductor wafer by which the occurrence of flaws, which may exert bad influences upon the subsequent exposure process, on the rear surface of a semiconductor wafer can be prevented effectively at the time of heat-treating the wafer by means of vertical thermal treatment equipment. <P>SOLUTION: The vertical boat 1 for heat-treating the semiconductor wafer is provided with at least a plurality of supports 4, a pair of boards connected to both ends of each support 4, and supporting sections which horizontally support the semiconductor wafer and are installed to the supports 4. The wafer supporting surface 3 of each supporting section is inclined downward. At the time of heat-treating the semiconductor wafer, the wafer is supported in an area which is separated from the outer peripheral edge section of the boat 1 by ≤3 mm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
