| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting a flip chip using an underfill resin, by which a semiconductor chip is not easily separated from an assembling substrate when they are mutually connected. <P>SOLUTION: The semiconductor chip 15, which has a pad 5 covered with a passivation film 7, is prepared, and by removing the passivation film 7 on the pad 5, the pad 5 is exposed. Then, a polyimide film 13 having an opening 12 for exposing the pad 5 is formed on the passivation film 7. Thereafter, a solder bump 14 is formed on the pad 5, the underfill resin 17 is filled between the assembling substrate 16 and the semiconductor chip 15, and the assembling substrate 16 and the semiconductor chip 15 are mutually connected through the solder bump 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
