发明名称 |
Heat dissipating apparatus |
摘要 |
A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base and at least one fin. The base is connected to the integrated heat spreader and has a concave area. When the base is connected to the integrated heat spreader, a contact area is thereby formed. The shape and position of the contact area correspond to those of the integrated heat spreader. The concave area is formed on the base and extended from the edge of the base to the contact area. The fin is formed on the base.
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申请公布号 |
US2004240181(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20030699775 |
申请日期 |
2003.11.04 |
申请人 |
CHUNG CHAO-TSAI;HSIAO WAN-CHIN |
发明人 |
CHUNG CHAO-TSAI;HSIAO WAN-CHIN |
分类号 |
H01L23/40;H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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