| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small-sized substrate with a built-in DC power supply circuit of high current capacity wherein connection reliability between electronic components in the built-in DC power supply is high, and to provide a method for manufacturing the substrate. <P>SOLUTION: The substrate with the built-in DC power supply circuit is provided with a power supply layer which is constituted of the DC power supply circuit which converts a DC voltage input from outside to a different DC voltage and arranged inside the substrate, a signal wiring layer and a ground layer. The power supply layer is provided with a component for power conversion which is constituted of semiconductor 11 for power supply, a high capacity solid capacitor 12, an inductor 13, a small capacity capacitor 14 and a chip resistor 15, a core substrate 10 on which the component for power conversion is arranged, and a power supply wiring layer. Incomplete via holes which are formed with UV laser and conductor are used for connection between electrodes of the component for power conversion and a wiring circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
