| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an environmental-friendly and inexpensive semiconductor wafer with improved productivity by omitting a polishing step. SOLUTION: This semiconductor wafer is manufactured as follows. A single face W1 of a lapped wafer LW is plane-ground, so as to remove waviness a generated in a slicing step. Thereafter, an etching volume is controlled, so as to remove a processing modification layer b generated in a plane polishing step. As a result, surface roughness is improved into a quasi-mirror condition, while a processing modification layer c generated on an opposite face W2 in a lapping step is also removed. COPYRIGHT: (C)2004,JPO&NCIPI
|
