| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin composition that gives a cured product having high heat resistance, a low dielectric constant, a low dielectric loss tangent and good mechanical properties such as tensile strength and tensile elongation, when an epoxy resin is used as a curing agent. SOLUTION: The polyimide resin composition contains a polyimide resin (X) having a carboxylic group and an aliphatic structure (1) with a number-average molecular weight of 100-1,000 at the terminal, preferably a polyimide resin having a carboxylic group, the aliphatic structure (1), a urethane bond, an imide ring, an isocyanurate ring and a cyclic polyaliphatic structure (3) and a polyimide resin (Y) having a carboxylic group and a linear polyaliphatic structure (2) with a number-average molecular weight of 300-6,000, preferably a polyimide resin having a carboxylic group, the linear polyaliphatic structure (2) with a number-average molecular weight of 300-6,000, a urethane bond, an imide ring, an isocyanurate ring and the cyclic polyaliphatic structure (3). COPYRIGHT: (C)2004,JPO&NCIPI
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