WAFER HOLDING BODY FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE MOUNTED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body for semiconductor manufacturing device having a wafer mounting surface improved in soaking property, and to provide a semiconductor manufacturing device mounted with the holding body. SOLUTION: A shaft which supports the wafer holding body having the wafer mounting surface is joined to the wafer holding body. When the heat capacity of the shaft is adjusted to≤40% of that of the wafer holding body, the temperature distribution on the wafer holding surface of the wafer holding body can be controlled to≤±1.0%. It is preferable that the wafer holding body is a ceramic heater having at least a resistance heating element. COPYRIGHT: (C)2004,JPO&NCIPI