| 摘要 |
In a film lamination method of the present invention, sound waves with a predetermined frequency are applied to at least one of a substrate or a film disposed on the substrate. Thus, by means of an acoustic vibration energy action, the adhesion of the film to the substrate and the quality of covering irregularities can be sufficiently enhanced and the embedding quality of the film to the irregular portions of the substrate can be achieved to a high standard. |
