POLISHING APPARATUS AND POLISHING METHOD USING THE SAME

摘要

PURPOSE: A polishing apparatus and a polishing method using the same are provided to form a uniform polishing layer by controlling pressure of a carrier head to distribute uniformly the pressure. CONSTITUTION: A polishing apparatus includes a turntable, a carrier head, and a magnetic pressure control unit. A polishing pad(101) is installed on a surface of the turntable(103). The turntable is rotated to the predetermined direction. The carrier head(105) is used for pressing a polished target on the polishing pad of the turntable. The carrier head is rotated to the predetermined direction to perform a polishing process. The magnetic pressure control unit includes a plurality of first magnetic force generators and a plurality of second magnetic force generators. The first magnetic force generators(111) are installed in the inside of the carrier head to generate the first magnetic force. The second magnetic force generators(115) are installed in the inside of the carrier head to generate the attractive force and the repulsive force corresponding to the first magnetic force generators.