| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the influence of a wire bonding residue produced by performing control of height of an MR element using the result of measurement by a real element detecting system during polishing work is performed. SOLUTION: When a floating surface of a thin film magnetic head is polished to set the height of the MR element at an MR head element to a prescribed value, if the real element detecting system is adopted in which a terminal 18a of the MR head element is wire bonded to a circuit board for measurement and the resistance value of the MR element is directly measured to control the height of the MR element, the wire bonding residue 24a remains at the terminal 18a even if the wire bonding is removed after the polishing work. The surface of the terminal 18a is arranged longitudinally, a peeling tool 25 is made to descend on the wire bonding residue 24a with a prescribed clearance C to peel the wire bonding residue 24a from the surface of the terminal 18a. In this manner, a dimple is generated in the surface of the terminal 18a however the wire bonding residue 24a is eliminated. COPYRIGHT: (C)2004,JPO&NCIPI
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