发明名称 |
POLYSTYRENE BASED MULTILAYER STRUCTURES AND PACKAGE USING THE SAME |
摘要 |
PURPOSE: A polystyrene based multilayer structured material and a package using the same are provided to have a good oil resistance, heat sealability and reusability. CONSTITUTION: The multilayer structure(10) comprises a surface layer(1) of a polyolefin based resin; an intermediate layer(2); and a substrate layer(3) of a polystyrene based resin. The intermediate layer comprises 25 to 75 wt.% of a polystyrene based resin, 75 to 25 wt.% of a polyolefin based resin and 1 to 20 parts by weight of a compatibilizer composed of a block copolymer based on the 100 parts by total weight of the polystyrene based resin and the polyolefin based resin. The block copolymer is a block copolymer of an aromatic vinyl and a conjugated diene.
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申请公布号 |
KR20040055651(A) |
申请公布日期 |
2004.06.26 |
申请号 |
KR20030092960 |
申请日期 |
2003.12.18 |
申请人 |
IDEMITSU UNITECH CO., LTD. |
发明人 |
YAMADA TOYOKAZU;ITAYA HITOSHI;ARAI YOSUKE |
分类号 |
B32B27/08;(IPC1-7):B32B27/08 |
主分类号 |
B32B27/08 |
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