发明名称 SPUTTERING METHOD AND SPUTTERING TARGET
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target which is obtained by preparing film-forming substances with inclined-type components (with different composition ratios) in concentrically circular shapes by a simple operation without individually preparing these substances with various kinds of compositions and which enables the change in composition of the substances in concentrically circular shapes and the substance properties corresponding to the change to be measured or investigated. SOLUTION: A sputtering method is provided which features that, by subjecting an integral target wherein different substances or compositions containing different substances are arranged adjacently in concentrically circular shapes to simultaneous sputtering, a sputter film containing the compounds or compositions in optional mixing ratios in concentrically circular shapes is formed on a substrate. The sputtering target is an integral one which, in sputtering, forms on a substrate a sputter film containing different substances or compositions containing different substances in optional mixing ratios in concentrically circular shapes and in which the different substances or the compositions containing different substances are arranged adjacently in concentrically circular shapes. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004162115(A) 申请公布日期 2004.06.10
申请号 JP20020329159 申请日期 2002.11.13
申请人 NIKKO MATERIALS CO LTD 发明人 TAKAHASHI HIDEYUKI;YAHAGI MASATAKA
分类号 C23C14/34;C40B50/00;G11B5/851;G11B7/26;(IPC1-7):C23C14/34 主分类号 C23C14/34
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