| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hardenable resin film and an electrically insulative material capable of simultaneously filling through-holes bored on the film and forming interlayer insulation layers and of producing built-up multi-layer printed-circuit boards by using the interlayer insulating layer in no need of grinding step. <P>SOLUTION: As for the hardenable resin film, the coefficient of linear expansion (X) in [ppm] is measured through the thermomechanical analysis after the resin is hardened, the reaction heat (Y) in [J/g] on the hardening reaction is measured through the differential scanning calorimetry (DSC) where X and Y satisfy the formula (1) Y≤-2.67X+374∼and the complex viscosity is 10,000-100,000 Pa s. The hardened resin film satisfying these conditions is used for producing build-up multi-layered printed circuit boards. <P>COPYRIGHT: (C)2004,JPO</p> |
