| 发明名称 |
Method of manufacturing multilayered printed wiring board using adhesive film |
| 摘要 |
The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled up. This method also involves using an adhesive film to facilitate manufacturing the multilayered printed wiring board having excellent surface smoothness at satisfactory yields.
|
| 申请公布号 |
US6739040(B1) |
申请公布日期 |
2004.05.25 |
| 申请号 |
US20000696179 |
申请日期 |
2000.10.26 |
| 申请人 |
AJINOMOTO CO., INC. |
发明人 |
NAKAMURA SHIGEO;YOKOTA TADAHIKO |
| 分类号 |
H05K3/38;H05K3/00;H05K3/24;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K6/36;H05K3/10;H05K1/03 |
主分类号 |
H05K3/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
