发明名称 METHOD OF FORMING STEPPED RECESS
摘要 <p>A method of forming recessed parts having steps lower than one face of a substrate and bottom faces lower than the steps in one face of the substrate, comprising the steps of forming a first resist layer (12) having openings allowing predicted recessed part formation positions on the one face to be exposed to the outside, forming a second resist layer (16) covering predicted step formation positions of the exposed parts on the one face in the openings of the first resist layer (12), applying etching to the exposed parts on the one face not covered by the second resist layer (16) in the openings of the first resist layer (12), selectively removing the second resist layer (16), applying etching to the entire part of the exposed part on the substrate in the openings of the first resist layer (12), and removing the first resist layer (12).</p>
申请公布号 WO2004041711(A1) 申请公布日期 2004.05.21
申请号 WO2003JP13654 申请日期 2003.10.24
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD.;KOIZUMI, NAOYUKI;MURAYAMA, KEI;KURIHARA, TAKASHI;HIGASHI, MITSUTOSHI 发明人 KOIZUMI, NAOYUKI;MURAYAMA, KEI;KURIHARA, TAKASHI;HIGASHI, MITSUTOSHI
分类号 B81C1/00;(IPC1-7):B81C1/00 主分类号 B81C1/00
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