发明名称 Heat dissipation member for electronic apparatus and method for producing the same
摘要 The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing. When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.
申请公布号 US2004094537(A1) 申请公布日期 2004.05.20
申请号 US20030472802 申请日期 2003.09.23
申请人 TANAKA KATSUFUMI;SUGIYAMA TOMOHEI;KINOSHITA KYOICHI;KONO EIJI;NISHINO NAOHISA 发明人 TANAKA KATSUFUMI;SUGIYAMA TOMOHEI;KINOSHITA KYOICHI;KONO EIJI;NISHINO NAOHISA
分类号 C22C1/05;C22C1/10;C22C29/06;C22C32/00;H01L23/373;(IPC1-7):H05B3/10 主分类号 C22C1/05
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