| 摘要 |
PROBLEM TO BE SOLVED: To reduce an inductance component of a lead part connected to a via-hole in a thin film capacitor element connected to a ground electrode or the like through the via-hole of an insulating substrate. SOLUTION: A via-hole 1a of an insulating substrate 1 consisting of a low temperature calcinated ceramic substrate is charged with a conductive material 5 such as Ag, and a lower electrode 2, a dielectric layer 3 and an upper electrode 4 are subjected to thin film formation on the insulating substrate 1. Thereby, a thin film capacitor element, whose capacitance value of a capacitor is prescribed by an overlapping part of the lower electrode 2 and the upper electrode 4 which are opposed via the dielectric layer 3, is formed. Here, the dielectric layer 3 is formed circular around the via-hole 1a (the conductive material 5), and a part which is exposed to an inner side from an inner peripheral edge of the dielectric layer 3 is made a lead part 2a of the lower electrode 2 and the lead part 2a is connected to a ground electrode 6 of the backside of the insulating substrate 1 through the conductive material 5. COPYRIGHT: (C)2004,JPO
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