| 摘要 |
The present invention relates to a method of manufacturing a thin film transistor in a semiconductor device. The present invention forms a single crystal silicon thin film on an interlayer insulating film on a single crystal driver transistor using a solid phase crystallization of amorphous silicon, forms a single crystal silicon thin film transistor (C-Si TFT) in the single crystal silicon thin film in order to uses it as a load transistor and uses a contact plug connecting a drain in the driver transistor and a drain in the load transistor as a SPC (solid phase crystallization) plug, in a process of depositing a silicon thin film on a single crystal transistor by a three-dimensional stack process to deposit to form a load transistor in a manufacture process of SRAM. Therefore, the present invention can improve the uniformity and reliability of the load transistor.
|
