发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
This invention provides a semiconductor device including a semiconductor substrate, a transistor having a gate insulation film on the semiconductor substrate and a gate electrode on the gate insulation film, and a device isolating insulation film having a first portion which extends from a surface of the semiconductor substrate to an inner part of the semiconductor substrate and a second portion which protrudes from the semiconductor substrate, wherein a side surface of the second portion is in direct contact with a side surface of the gate electrode at least partially and a cross section of the gate electrode is reverse tapered. This invention also provides a manufacturing method thereof.
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申请公布号 |
US2004063266(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030670249 |
申请日期 |
2003.09.26 |
申请人 |
NARITA KAZUHITO;SAKAGAMI EIJI;TSUNODA HIROAKI;SONODA MASAHISA;KOBAYASHI HIDEYUKI |
发明人 |
NARITA KAZUHITO;SAKAGAMI EIJI;TSUNODA HIROAKI;SONODA MASAHISA;KOBAYASHI HIDEYUKI |
分类号 |
H01L21/28;H01L21/76;H01L21/762;H01L21/8234;H01L21/8247;H01L27/115;H01L29/423;H01L29/43;H01L29/49;H01L29/788;H01L29/792;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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