发明名称 Semiconductor device and method of manufacturing the same
摘要 This invention provides a semiconductor device including a semiconductor substrate, a transistor having a gate insulation film on the semiconductor substrate and a gate electrode on the gate insulation film, and a device isolating insulation film having a first portion which extends from a surface of the semiconductor substrate to an inner part of the semiconductor substrate and a second portion which protrudes from the semiconductor substrate, wherein a side surface of the second portion is in direct contact with a side surface of the gate electrode at least partially and a cross section of the gate electrode is reverse tapered. This invention also provides a manufacturing method thereof.
申请公布号 US2004063266(A1) 申请公布日期 2004.04.01
申请号 US20030670249 申请日期 2003.09.26
申请人 NARITA KAZUHITO;SAKAGAMI EIJI;TSUNODA HIROAKI;SONODA MASAHISA;KOBAYASHI HIDEYUKI 发明人 NARITA KAZUHITO;SAKAGAMI EIJI;TSUNODA HIROAKI;SONODA MASAHISA;KOBAYASHI HIDEYUKI
分类号 H01L21/28;H01L21/76;H01L21/762;H01L21/8234;H01L21/8247;H01L27/115;H01L29/423;H01L29/43;H01L29/49;H01L29/788;H01L29/792;(IPC1-7):H01L21/823 主分类号 H01L21/28
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