SEMICONDUCTOR FABRICATING APPARATUS

摘要

PURPOSE: A semiconductor fabricating apparatus is provided to remarkably shorten an interval of time for forming a process condition by preventing air from being induced from the outside to the inside of a furnace while purge gas is vertically sprayed on the condition that the inlet of a path through which a wafer is loaded/unloaded is open. CONSTITUTION: Impurity gas is injected into a side of the inside of a tube having a process atmosphere of uniform temperature and pressure so as to form a layer necessary for the wafer. A purge gas spraying member is installed in the upper surface of a compression plate at the end of the semiconductor fabricating apparatus such that the compression plate loads/unloads the wafer into/from a wafer tray inside the tube. A plurality of nozzles are downward installed in the purge gas spraying member so as to be connected to a path that horizontally passes through the compression plate. When the path is opened by a door, purge gas from the nozzle is sprayed and air is prevented from being induced from the outside.