发明名称 |
Stacked semiconductor module and method of manufacturing the same |
摘要 |
A stacked semiconductor module includes a lower chip scale package (CSP) mounted on a module board, and an inverted upper CSP attached to the top of lower CSP to form a stacked semiconductor package. The lower and upper CSPs are electrically connected to each other outside of the stacked semiconductor package. This electrical connection may be made using the module board. Further, a conductive interconnection tape may be used to electrically connect the upper CSP to regions on the module board, which are electrically connected to the region at which the lower CSP is electrically connected to the module board.
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申请公布号 |
US2004018661(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
US20030376343 |
申请日期 |
2003.03.03 |
申请人 |
BAEK JOONG-HYUN;LEE JIN-YANG;IM YUN-HYEOK;LEE TAE-KOO |
发明人 |
BAEK JOONG-HYUN;LEE JIN-YANG;IM YUN-HYEOK;LEE TAE-KOO |
分类号 |
H01L23/538;H01L25/10;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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