发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a plurality of transistors which are a darlington circuit are connected to an output terminal of a semiconductor circuit to enhance a breakdown resistance. SOLUTION: A protection circuit 1b having a plurality of bipolar transistors Q1 to Q10 which are the darlington circuit is electrically connected to an output (between a collector and an emitter) of an amplifier circuit 3 of a high output in parallel to the amplifier circuit 3. The amplifier circuit 3 is constituted to have a plurality of unit HBTs (hetero-junction bipolar transistors) QH1 to QHn which are connected in parallel to each other. Further, the protection circuit 1b is constituted in two steps of having first and second groups consisting of a protection circuit 1b1 having the bipolar transistors Q1 to Q5 and the bipolar transistors Q6 to Q10. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004006531(A) |
申请公布日期 |
2004.01.08 |
申请号 |
JP20020160432 |
申请日期 |
2002.05.31 |
申请人 |
RENESAS TECHNOLOGY CORP |
发明人 |
UMEMOTO YASUNARI;ONO HIDEYUKI;TAGAMI TOMONORI;OSONE YASUO;OBE ISAO;KUSANO CHUSHIRO;KUROKAWA ATSUSHI;YAMANE MASAO |
分类号 |
H01L21/331;H01L21/822;H01L21/8222;H01L27/02;H01L27/04;H01L27/06;H01L27/082;H01L29/737;H01L29/861;H03K17/0814;H03K17/615;(IPC1-7):H01L27/06 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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