| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment which can be always stably operated while the bonding strength of a power amplifier circuit element to a substrate is increased. SOLUTION: This electronic equipment 10 is configured by mounting a frame body 1b on the upper face of a substrate 1a to form a cavity 4 inside the frame body 1b, and housing a power amplifier circuit element 2 whose lower face has a connection electrode 5 electrically connected through conductive adhesive 9 to a connection pad 7 formed on the upper face of the substrate in the cavity 4, and forming a recessed part 8 on the upper face of the substrate 1a positioned just under the power amplifier circuit element 2. A metallic radiator plate 3 butted to the upper face of the power amplifier circuit element 2 is bonded to the upper face of the frame body 1b. COPYRIGHT: (C)2004,JPO |
