| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a package size and to prevent the generation of molding defects in a resin sealed type semiconductor device. <P>SOLUTION: The resin sealed type semiconductor device is provided with a semiconductor chip 2 loaded on a die pad 1, a plurality of leads 5 arrayed on the periphery of the die pad 1 so that adjacent leads having the same widths are arrayed in parallel, and die pad suspension parts 9 formed so that inner ends of prescribed leads 5 among the plurality of leads are directly connected to the outer periphery of the die pad 1. <P>COPYRIGHT: (C)2004,JPO |
