发明名称 |
CONNECTOR MOLDING METHOD AND SHIELDED WAFERIZED CONNECTOR MADE THEREFROM |
摘要 |
A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk. |
申请公布号 |
WO02060011(B1) |
申请公布日期 |
2003.11.06 |
申请号 |
WO2002US01883 |
申请日期 |
2002.01.23 |
申请人 |
TERADYNE, INC. |
发明人 |
ASTBURY, ALLAN, L., JR.;COHEN, THOMAS, S. |
分类号 |
H01R12/50;H01R13/514;H01R13/658 |
主分类号 |
H01R12/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|