发明名称 |
Integrated circuit with opposed spatial light modulator and processor |
摘要 |
An integrated circuit may have a spatial light modulator formed on one side of a semiconductor support and a microprocessor formed on the opposite side. The microprocessor and the spatial light modulator may communicate with one another through electrical connections which extend completely through the semiconductor support. The microprocessor may be contacted using bump packaging techniques.
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申请公布号 |
US6639714(B2) |
申请公布日期 |
2003.10.28 |
申请号 |
US20010035643 |
申请日期 |
2001.11.07 |
申请人 |
INTEL CORPORATION |
发明人 |
SMITH RONALD D.;RAJ KANNAN |
分类号 |
G02F1/13;G02F1/1333;G02F1/1345;G02F1/1362;H01L27/15;(IPC1-7):G02F1/00;H01L23/02;H01L23/04 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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