| 摘要 |
A sub-mount having a structure for affixing one or more optoelectronic device chips, the structure comprising a plurality of bump studs on a metal pad which is located on the substrate of the sub-mount, each bump stud comprising a metal protrusion which when heated is capable of bonding to the surface of the optoelectronic device. Subarrays of bump studs may perform different functions such as local or external electrical connectivity, thermal dissipation and structural support, with routing pattens connecting together studs associated with the same function. |
