MICRO-ELECTRO-MECHANICAL SYSTEMS PACKAGING

摘要

A micro-electro-mechanical-system "MEMS" die having a bottom part (24) and a top part (22), the bottom part having a bottom length and a bottom width, the top part having a top length and a top width; at least one of the bottom length and the bottom width being of a greater dimension than the corresponding top length and top width to thereby form an upper surface on the bottom part on which upper surface interconnect pads are provided. A multi-technology module (10) using such a MEMS as well as at least one other die of a different technology, and a substrate (18) for the module, are also disclosed.