发明名称 |
Method of making a lamination and surface planarization for multilayer thin film interconnect |
摘要 |
A method of making a surface planarization is provided using a separate pre-cut or precured film laminated onto a metallized surface to form planarized dielectric coating. The method comprises the steps of: (a) providing a thin film interconnect module with a polyimide adhesive laminated with a pre-cut or pre-cured polyimide lamination film on the top of the polyimide adhesive, the polyimide lamination film being covered with a glass plate; (b) applying pressure and heat in a synchronized format to ensure a uniform curing and gap filling in the thin film module metal for the adhesive layer; and (c) releasing the glass plate to expose a smooth lamination film surface.</PTEXT>
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申请公布号 |
US6632314(B1) |
申请公布日期 |
2003.10.14 |
申请号 |
US19990474189 |
申请日期 |
1999.12.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YU RONGQING;KELLY KIMBERLEY A.;PRASAD CHANDRIKA;KANG SUNG KWON;PURUSHOTHAMAN SAMPATH |
分类号 |
H01L21/48;H05K3/28;H05K3/46;(IPC1-7):B32R31/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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