Method and apparatus for optical lifetime tracking of trench features

摘要

A method and an apparatus for performing process lifetime tracking of trench feature using optical analysis. A plurality of process steps is performed on a first set of semiconductor wafers. A manufacturing lifetime tracking of trench features is performed. A feedback corrective process is performed on a second set of semiconductor wafers based upon the lifetime tracking trench features. A feed-forward corrective process is performed on the first set of semiconductor wafers based upon the manufacturing lifetime tracking of trench features.